QFN Tape (Acrylic PSA)

 high-temperature resistant,Plasma Clean and no silicon precipitation problems
 Good stability,flatness, residue free after removal at high temperature

 Used in QFN molding process before Wire bond

Material Thickness(µm)

Thickness(mm)

180° Peel Adhesion

(kg/inch)

Adhesive Base

Temperature Range(°C)

25

0.032

0.2↓

Acrylic

180 ℃× 0.5HR
260 ℃ MAX.

QFN Tape (Silicone PSA)

Good stability,flatness, residue free after removal at high temperature

Used in QFN molding process, to avoid EPOXY bleeding.

Material Thickness(µm)

Thickness(mm)

180° Peel Adhesion

(kg/inch)

Adhesive Base

Temperature Range(°C)

25

0.036

0.15↓

Silicone

180 ℃× 0.5HR
260 ℃ MAX.