QFN Tape (Acrylic PSA) high-temperature resistant,Plasma Clean and no silicon precipitation problems Good stability,flatness, residue free after removal at high temperature Applications Used in QFN molding process before Wire bond Product Specifications Material Thickness(µm)Thickness(mm)180° Peel Adhesion(kg/inch)Adhesive BaseTemperature Range(°C)250.0320.2↓Acrylic180 ℃× 0.5HR260 ℃ MAX. QFN Tape (Silicone PSA) Good stability,flatness, residue free after removal at high temperature Applications Used in QFN molding process, to avoid EPOXY bleeding. Product Specifications Material Thickness(µm)Thickness(mm)180° Peel Adhesion(kg/inch)Adhesive BaseTemperature Range(°C)250.0360.15↓Silicone180 ℃× 0.5HR260 ℃ MAX.