After irradiating UV ultraviolet light, the adhesive force is greatly reduced, so that the object is easily separated from the adhesive without leaving residue.
The tape used for Wafer, glass dicing, back grinding, miniature Copper Foil, PCB cutting, and can be easily removed after finishing the productions process.
With the adhesive at room temperature, the use of temporarily fixing the process to avoid displacement or batch carry-over, and while finishing the productions process, the tape can be easily removed by heating up to reduce the Adhesion Force.
The Adhesion Force can be increased by heating up to prevent the process from stripping off. And it will return to the original adhesive to be easily removed when the temperature is cooling down.