QFN Tape Polyimide
QFN Polyimide Tape
To prevents mold leakage during lead frame epoxy molding compound (EMC) process.
DESCRIPTION
- Highly heat-resistant.
- Even after the tape is removed, no adhesive residue remains.
- No flash burr during EMC molding processing.
- Little warpage of lead frame even at high temperature.
- Excellent adhesive property with wires
