UV Release Film Tape
This tape can temporarily fix components at certain temperatures and be removed by UV irradiation. It is suitable to protect surface of semiconductor wafer during grinding process, and to hold semiconductor wafer with ring frame during dicing process.
DESCRIPTION
| Product Name | |||||||||||||||||||||||||||||
| POKNT150T - UV Release Film Tape | |||||||||||||||||||||||||||||
| Tape can be peeled off easily after UV cure, suitable for temporary bonding. | |||||||||||||||||||||||||||||
| Technical Data | |||||||||||||||||||||||||||||
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