UV Release Film Tape

This tape can temporarily fix components at certain temperatures and be removed by UV irradiation. It is suitable to protect surface of semiconductor wafer during grinding process, and to hold semiconductor wafer with ring frame during dicing process.


DESCRIPTION

Product Name
POKNT150T - UV Release Film Tape
Tape can be peeled off easily after UV cure, suitable for temporary bonding.
Technical Data
Surface Material Adhesive Temperature
Range (oC)
Liner
Material Thickness
(mm)
Color Adhesive
Base

Adhesion
(Kg/inch)
Before UV

Adhesion
(Kg/inch)
After UV
Material Thickness
(mm)
Color
Polyolefin 0.15 Clear Acrylic 1.0 0.05 5 ~ 80 PET 0.05 Clear