




Thermal Release Film Tape
This unique adhesive tape adheres tightly at room temperature and can easily be peeled off when heated to a certain temperature. The tape is widely used for semiconductor, MLCC, FPCB and other electric/electronic components processing.
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TFA1106 - Termal Release Film Tape | |||||||||||||||||||||||||||||
Tape can be peeled off easily when heated to certain temperature, suitable for temporary bonding. | |||||||||||||||||||||||||||||
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HTFA0129 - Termal Release Film Tape | |||||||||||||||||||||||||||||
Tape can be peeled off easily when heated to certain temperature, suitable for temporary bonding. | |||||||||||||||||||||||||||||
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