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Thermal Release Film Tape

This unique adhesive tape adheres tightly at room temperature and can easily be peeled off when heated to a certain temperature. The tape is widely used for semiconductor, MLCC, FPCB and other electric/electronic components processing.

DESCRIPTION

Product Name
TFA1106 - Termal Release Film Tape
Tape can be peeled off easily when heated to certain temperature, suitable for temporary bonding.
Technical Data
Surface Material Adhesive Release Temperature
 (oC)		 Liner
Material Thickness
(mm)		 Color Adhesive
Base		 Adhesion
(Kg/inch)		 Release
Force
(g/inch)		 Material Thickness
(mm)		 Color
Polyester 0.10 Clear Acrylic 0.150 5 120@3min PET 0.036 Clear
 
Product Name
HTFA0129 - Termal Release Film Tape
Tape can be peeled off easily when heated to certain temperature, suitable for temporary bonding.
Technical Data
Surface Material Adhesive Release Temperature
 (oC)		 Liner
Material Thickness
(mm)		 Color Adhesive
Base		 Adhesion
(Kg/inch)		 Release
Force
(g/inch)		 Material Thickness
(mm)		 Color
Polyester 0.075 Clear Acrylic 0.50 5 180@3min PET 0.050 Clear